Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : November 07, 2019 - November 08, 2019
Abstruct In semiconductor production, efficiency and precision of the cleaning process are very important. In this study, we handle “single wafer cleaner” that is one of the washing methods in the way of blowing air to a wafer with a turning disk at a high speed. However, the flow in the device becomes turbulence, which causes a problem that water drops and dusts reattach to the wafer surface. It is necessary to understand the flow in the device exactly to solve this problem. In the previous study, we found that there were “large-scale vortices” appearing inside the device, which causes particle reattaching to the wafer. In this study, we studied how they were created or disappeared. We found that the vortices were related to the speed of the rotating disk and the downflow rate.
