The Proceedings of Conference of Hokuriku-Shinetsu Branch
Online ISSN : 2424-2772
2008.45
Session ID : 715
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715 Application of a thermal network method to the thermal analysis of electronic devices including phase change materials
Noriyuki Fujii, Sadakazu Takakuwa, Masaru Ishizuka, Shinji Nakagawa
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Keywords: thermal network, CFD, phase change materials
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© 2008 The Japan Society of Mechanical Engineers
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