Al-Cuの異種材超音波接合における相対運動の可視化

抄録

This paper focuses on relative motion behavior in ultrasonic bonding of aluminum alloy and Copper. The relative motion of sheet-shaped bonding materials, bonding tools and peripheral dies are visualized by in-situ observation with a high-speed video camera and image analysis. The bonding phenomenon is discussed based on the relative displacement at the bonding interface, as well as the microstructural evolution. The relative motion between at the bonding interface transitionally changes during the ultrasonic bonding. From the microstructural observation, it has been found that the joint strength is governed by macroscopic-plastic deformation of the aluminum alloy. The plastic deformation induced by the relative motion between the ultrasonic tool and the aluminum alloy sheet contributes the bond formation between Copper sheet, resulting in the high joint strength.