109 銅電解メッキ膜のナノインデンテーション試験

抄録

The mechanical properties of a Copper electroplating film and Copper bulk material are measured using a Nanoindentation test. This lating film was an amorphous substance (amorphous) after it left it for 24 hours or more in the room temperature, and it became a result by Koike et al. and a different result. The hardness of the copper plating film has lowered overall by about 20% compared with the bulk material. It is thought that hardness lowered to the hardness of the copper plating film overall because hardness including this pore.