Diamond like carbon (DLC) thin films are already used in various mechanical applications due to its attractive properties such as high hardness, low friction coefficient, chemical inertness etc. Recently, its semiconducting properties are attracted. We investigated thermoelectric performance of DLC thin films prepared on glass substrates by RF plasma CVD method. The results indicated that Seebeck coefficient decreased and electrical resistivity increased due to the doping Si. In other words, the thermoelectric performance was influenced by doping Si. The highest power factor was obtained for un-doped DLC. Therefore, Un-dope DLC had the greatest thermoelectric performance. Thermal conductivity for all DLC samples were approximately 0.8 [W/(m・K)] at room temperature.