茨城講演会講演論文集
Online ISSN : 2424-2683
ISSN-L : 2424-2683
セッションID: 515
会議情報
515 PELID法を使った微細砥粒分散への取組み(OS7-4 オーガナイズドセッション《精密/微細加工と評価》)
綿引 達哉伊藤 伸英井手上 敬梅津 信二郎秋山 寛郎
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会議録・要旨集 フリー

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抄録
By the processing such as optics and electronic parts, accuracy of finishing and quality of the processing side controls the performance. Therefore these processing precision have been severe recently. It is effective to use a minute abrasive whetstone as one of the technique to improve processing aspect quality by grinding, but there is a problem of the blocking. One of the methods to solve this problem includes ELID grinding. This method is the technique that dressing does while processing a whetstone side and enable the use of the whetstone using the super minute abrasive of around several nanometers. However, the whetstone using the abrasive of around several nanometers has difficulty in dispersion of the abrasive in bond materials. Therefore we build the technique to make a whetstone to scatter uniformly the super minute abrasives using the PELID technology and can go ahead through the examination for the purpose of realizing a highly precise processing side of optics, electronic parts. In this report, we produced the PELID device to scatter abrasives and investigated dispersion properties of the liquid with this device and the abrasive.
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© 2012 一般社団法人 日本機械学会
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