金属含有多孔質定盤の研磨効果の検討

抄録

In recent years, demand for sapphire substrate is expected. Sapphire has characteristics of high hardness, high strength, high heat resistance, high corrosion resistance and high permeability, and therefore it is applied to various machines. Copper and tin platens are used for polishing of sapphire substrates. However, sapphire is said to be poorly processed due to difficult processing materials. Therefore, we will conduct a material characteristic and polishing characteristic of sapphire substrate using a copper platen currently used for processing and a newly developed metal containing porous platen, and compare and investigate the polishing characteristics.