Abstract
In the area of the manufacturing of plane display and semiconductor, there is a problem that the micro particles which are adhered in the manufacturing process give bad influence to the yield of product. In recent years, a demand of removal of them has been becoming tight from a viewpoint of the yield. Namely, considering the adhesive force and an adhesion state of the material and so on, respectively, the development of new technology to pick them up is needed. In this paper, we present a manufacture technology of microgripper which grips the micro particles and experiment in removal of adhered particles by the developed microgripper. As a result, under the observation of an SEM, picking up micro particles of several micrometer diameter is succeeded by using the device which we developed.
