抄録
This paper describes evaluation of bond strength in MEMS soldering package heated by using Al/Ni multilayer film. Al/Ni multilayer film deposited by DC magnetron sputtering shows self-propagating exothermic reaction. By applying a spark to the reactive film, the film generates heat enough to melt eutectic solder film. The heat of reaction depended on Al/Ni bilayer thickness and the total film thickness. We used the Al/Ni multilayer film as a local heat source in MEMS soldering packages. The solder film-bonded silicon elements by the local heating was fabricated without other external heat sources. The bond strength examined by blister test for package was evaluated by weibull distribution.
