Wettability of Substrate and Printing Surface of Fabrication Process for Flexible Device

Abstract

In recent years, attention has been paid to a printed electronics technology for producing a lightweight and flexible flexible device by printing a conductive ink on a thin and flexible continuous medium web. We focused on thin film pressure sensors among flexible devices fabricated by printed electronics technology. Since it was found that ink was played on the substrate and each printing surface when the sensor was fabricated, in this study, the wettability of the substrate and each printing surface in the sensor manufacturing process was evaluated.