IIP情報・知能・精密機器部門講演会講演論文集
Online ISSN : 2424-3140
セッションID: D-04
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フレキシブルデバイス作製過程の基板及び印刷面の濡れ性評価
*田島 伸一池田 祐太橋本 巨砂見 雄太
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In recent years, attention has been paid to a printed electronics technology for producing a lightweight and flexible flexible device by printing a conductive ink on a thin and flexible continuous medium web. We focused on thin film pressure sensors among flexible devices fabricated by printed electronics technology. Since it was found that ink was played on the substrate and each printing surface when the sensor was fabricated, in this study, the wettability of the substrate and each printing surface in the sensor manufacturing process was evaluated.
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