抄録
Debonding along both interfaces of a thin ductile adhesive layer, sandwiched between two elastic substrates, is considered. The layer is taken to be elastic-plastic, with the interfaces failing by a void growth mechanism. Microscopic cell elements. each of which contains a discrete void, are placed ahead of both advancing crack tips. The modified Gurson [1] model is used to describe void growth of the cell assisted by vapour pressure, leading to material softening and eventual loss of stress carrying capacity. This is followed by void coalescence and the formation of new crack surfaces. A symmetric mode I loading of the adhesive joints is examined, with emphasis on the steady-state work of fracture under small scale yielding. Three important extrinsic parameters-modulus modulus mismatch of the layer, vapour pressure, and residual stress-are studied to determine the effects on the adhesion toughness of the interface. Other parameters will be examined in a later study.
