抄録
The high-precision machining surfaces of oxygen-free high conductivity copper were treated by argon ion bombardment. The characteristics of diffusion bonding joints were investigated by the tensile strength of joints, bonded area and microstructure analyses of fractured surface. The results showed that the argon ion bombardment treatment was effective to clean the bonded surface and reduce the inclusions at the bonded interface. For the joints by un-bombardment treatment, bonding strength of the real bonded area at bonding temperature of 700℃ was 193 MPa, and bonding strength at 200℃ was 247 MPa for the joints by argon ion bombardment treatment, which was the same as that of base copper metal. Bonding area of diffusion bonding joints could be estimated using the two-dimensional model calculation.
