関西支部講演会講演論文集
Online ISSN : 2424-2756
セッションID: 219
会議情報
219 光放射圧を利用した微粒子操作によるマイクロ加工に関する研究(OS-2 機械加工(1))
三好 隆志清水 浩貴
著者情報
会議録・要旨集 フリー

詳細
抄録
This paper presents a new micro-machining using optical radiation pressure induced by incident laser light, which is based on laser trapping technology. In order to verify the feasibility of our proposed micro-machining technology, we performed the fundamental experiments based on the simulation results. As a result, we found that the proposed micro-machining will make it possible to effectively remove the surface up to the depth of several nm using the diamond grain rotated by the radiation pressure, even if the pressure force is as small as 0.1 nN.
著者関連情報
© 2000 一般社団法人 日本機械学会
前の記事 次の記事
feedback
Top