関西支部講演会講演論文集
Online ISSN : 2424-2756
会議情報
1305 熱異方性を考慮したプリント基板の熱解析
加茂 友規田島 秀男中 政道浅井 重美
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会議録・要旨集 フリー

p. _13-9_-_13-10_

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抄録
This paper describes the thermal analysis of Printed Circuit Board (PCB). Because the modeling of PCB has hitherto been very poor, the thermal simulation results cannot satisfy the required accuracy. To solve this problem, we divide into each layer that constitutes the PCB, and considers that each layer is a homogeneous material. And the thermal conductivity of every layer is computed with reference to the wiring area ratio. However, by this method, the anisotropic thermal conductivity of PCB cannot be modeled. Then we divide the PCB into a set of blocks and computed each thermal conductivity in consideration of the wiring area ratio and the wiring direction with reference to the wiring diagram, and created the analysis model reflecting the anisotropic thermal conductivity of PCB.
著者関連情報
© 2003 一般社団法人 日本機械学会
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