Study of the strain rate dependence of polymer, metal materials by carrying out tension tests and numerical analysis for a finite element model of electronic product

Abstract

In order to develop electron devices, various engineering materials such as polymers and metals are modeled to carry out CAE analysis to evaluate those strength. In this study, a series of tension tests for PC/ABS, SUS304, and so on were carried out within a wide range of strain rate from 10^-2 to 10² s^-1. Then, the practical material models for those were made by taking the strain rate dependence into consideration and were applied to the dynamic FEM analysis of a smart phone to estimate the effect of the accuracy of material model on the dynamic response of the device.