はんだクラックを有するパワーモジュールの熱過渡解析による

放熱性評価(単結晶シリコンの熱伝導特性が及ぼす影響)

抄録

The purpose of this study is to clarify the relationship between solder cracks of power modules and thermal resistance as an indicator of heat radiation. We conducted thermal transient analysis of the power module by measurement and calculation, and improved the calculation accuracy by considering the anisotropic heat conduction of single crystal silicon.