The Proceedings of Conference of Kanto Branch
Online ISSN : 2424-2691
ISSN-L : 2424-2691
2016.22
Session ID : OS0111
Conference information
OS0111 Behavior of water flow on rotating wafer in cleaning process
Ryota KOSHINO, Kenji AMAGAI, Yuhei HOSOYA, Hirokuni HIYAMA, Akira FUKUNAGA, Satomi HAMADA
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Keywords: Rotating wafer, Water flow, Cleaning process, Hydraulic jump
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Abstract
Behavior of water flow on rotating wafer were experimentally investigated. Liquid film thickness were measured by using a laser displacement meter. Shear force at the wafer surface by liquid film flow was estimated from the liquid film thickness. Removable diameter of the fine particles was estimated from the shear force. It was confirmed that the minimum removable diameter of fine particle become large around the area of hydraulic jump.
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© 2016 The Japan Society of Mechanical Engineers
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