Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : March 17, 2018 - March 18, 2018
The use of lead-free solder alloy is required by the RoHS directive. Sn-Bi alloy is one of candidate material for low temperature bonding. However, Sn-Bi alloys has low ductility and then improves the brittleness using superplasticity. The purpose of study is to investigate the deformation behavior of Sn-Bi-Cu alloys using inhomogeneous specimens. It is found that cross-section inhomogeneity factor has an influence on strain rate.
