Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : March 10, 2021 - March 11, 2021
The particle adhesion behavior on a rotating wafer during rotation cleaning was investigated experimentally. Acrylic plate with Si surface treatment was used as a test plate. A high-speed camera was set under the acrylic plate for recording the adhesion behavior of the particles. Adhesion rate was measured from the images captured by high-speed camera. As a result, it was confirmed that the particles adhered in proportion to time. Increasing rate of the number of adhered particles did not depend on the radial positions. Also, particle size did not depend on the adhesion characteristics. In addition, the behavior of dropped droplet containing the particles on the liquid film flow formed on the rotating plate was investigated. It was confirmed that the particles contained in the droplet adhered to the plate surface. This results suggested that the particles contained in the droplets were penetrated into the laminar sub-layer.
