102 微粒メタルボンドダイヤモンド砥石を用いたセラミック球研削におけるTiO_2微粒子添加の効果(O.S.1-1 精密研削加工)(O.S.1 : 高精密加工)
詳細
It is desirable from industry that the polishing process using loose abrasive is replaced by grinding process. This paper explores this possibility by investigating the effect of the free radical reaction oh the grinding performance of SD8000 metal bonded diamond wheels. The free radical was generated with aid of TiO_2, a kind of photo-catalyst. Experiments were conducted for ceramic ball grinding with a metal bonded diamond wheel of SD8000. It is found that the material removal rate increases by a factor of about 6 when adding 7.5wt% of TiO_2 into grinding fluid which was water in this experiment.
