Abstract
Fullerene has some special structural, physical, and mechanical properties. The precise and efficient machining by this material to the required quality has not yet been well established. In this paper, a comparative study was conducted to investigate the special aspects in the polishing of silicon wafer using the fullerene wheel, and the diamond wheel of super fine grains. The stability of surface roughness, effects of material grains sizes on the grinding results, and microscopic analysis of grinding phenomena by both materials were also analyzed in detail. The sintering temperature of near 700℃ is suitable for manufacturing diamond wheel. The carbon beads fit to fabricate the small pores in the vitrified-bonded wheel in comparison with the polyethylene beads. The surface roughness of hardened steel is rather larger when ground by 0〜1/8μm than when ground by 0〜1/4μm of diamond grain. This is because the abrasive grains were covered with the bond. It was clarified that we can obtain the surface roughness of 5nm Ra when using fullerene in polishing of silicon wafer.
