Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21
Online ISSN : 2424-3086
ISSN-L : 2424-3086
2005.1
Conference information
Improvement of Ground Surface Roughness of Optical Materials by Means of Cutting Edge Truncation of Metal-Bonded Diamond Grinding Wheel(Superabrasive/new wheel grinding process)
Xijun KANGJun'ichi TAMAKIAkihiko KUBOJiwang YANToshirou IYAMA
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 193-198

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Abstract
Glass quartz, crystal quartz and single crystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.
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© 2005 The Japan Society of Mechanical Engineers
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