Effect of coolant flow rate on surface topography when precision grinding silicon using mounted diamond pins

Abstract

Much effort has been made in machining hard and brittle materials. However, less attention is paid to the amount of coolant that contributes to generating ductile streaks especially when machining small areas on brittle materials like silicon. This paper presents partial-ductile grinding of mono-crystalline silicon using 64 μm resinoid-bonded diamond mounted pins on conventional MAHO NC vertical Milling machine. Ground work-pieces were examined both qualitatively and qualitatively. Evaluations of the results reveal condition of optimum flow rate where minimal micro fractures occurred and indicating surface finish as low as 30 nm. Interrelationship between machining parameters is also established