Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : November 07, 2007 - November 09, 2007
For the planarization process of LSI wafers, metal bumps covered with polymer glue are machined with a diamond tool. In this study, the deformation process and temperature field in this process are analytically simulated with FEM. In order to analyze the cutting process for resin which has a viscosity, the cutting simulator first has to treat the visco-elastic-plastic material property. Secondly, to analyze the cutting at the micro-meter level depth of cut, the analysis model was scaled down. Finally, to simulate the cutting process of a LSI wafer, PVC and 70% Cu-30% Zn brass were assigned a resin and a metal part, respectively.
