Fundamental Study on Cleavage-Cutting of Silicon Wafer by Ultra-Short Pulsed Laser

Abstract

The aim of this study is to explore the possibility of applying ultra-short pulsed Laser into cleavage-cutting of silicon wafer. Unlike the conventional Laser machining which transforms the power into heat energy to remove the materials, ultra-short pulsed Laser removes materials by a behavior called "ablation" if the incoming Laser power is big enough. "Ablation" is able to directly break off the chemical bonding of the materials by multi-photon absorption without introducing heat effect. In this study, tension tests and three-point bending tests are performed after irradiation with different conditions to acquire the fundamental data for Laser cleavage-cutting.