Abstract
Small hole open process by grinding on zirconia ceramics developed for semiconductor mold was examined in this study. The helical machining with the smaller wheel diameter rotating like the spiral by feed drive was introduced as a method. The method is better than the method when the hole of the same diameter as the wheel diameter is made because of the tool load reduction. For obtaining the possibility of process and the better processing conditions, the grinding force was monitored. Then the processing conditions that seemed to be the best were examined.