Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21
Online ISSN : 2424-3086
ISSN-L : 2424-3086
2015.8
Session ID : 1202
Conference information
1202 Laser Irradiation Control Method in Via-Hole Drilling of Printed Wiring Board Based on High Speed Camera Monitoring
Munetaka IOZUMIToshiki HIROGAKIEiichi AOYAMAKeiji OGAWA
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Abstract
A CO_2 laser is used to drill blind via holes (BVHs) in printed wiring boards for circuit connections. Thermal input from the laser drilling causes deterioration in the quality of the material around the hole. Therefore, we propose a method to set the minimum cooling time between pulses without lowering the drilled hole quality using a high-speed camera image monitor. As for the results, from the change in the luminance value of each pulse, we were able to use this method to set a cooling time between pulses to minimize the drilling and irradiation times when forming BVHs.
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© 2015 The Japan Society of Mechanical Engineers
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