Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21
Online ISSN : 2424-3086
ISSN-L : 2424-3086
2017.9
Session ID : 004
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Analysis of variance in optical inspections of wafer thickness
Teppei ONUKIHirotaka OJIMAJun SHIMIZULibo ZHOU
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Abstract

In this study, error characteristics of the thickness measurements are systematically investigated to obtain true thickness profiles of the wafers under uncertain measurement conditions. Specified factors of disturbing signals in spectroscopic data are analyzed regarding misalignment of the measurement instruments, surface integrity of wafers, and post analysis of spectroscopic data; for the causality inferences in the aberrant features in reflection spectroscopic measurements.

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© 2017 The Japan Society of Mechanical Engineers
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