抄録
The polishing performance of the zirconium oxide (Zr02) abrasive as an alternative material for the cerium oxide (CeO2) abrasives for glass was investigated. The Zr02 abrasives containing Si02 particles had a higher removal rate than the pure Zr02 abrasives. The epoxy resin polishing pad showed a higher removal rate than a conventional urethane pads with all tested Zr02 abrasives. Si02-containing Zr02 abrasives combined with the epoxy polishing pad had a higher removal rate than CeO2 with the urethane polishing pad, indicating that CeO2 abrasives can be completely replaced by Zr02 abrasives. The dependence of polishing conditions on the polishing performance was also examined.
