抄録
Micro machining of glass is required for manufacturing of glass devices such as micro TASs. However, some issues have been left on the flexibility, the machining costs and the environmental impact in the manufacturing. In glass cutting, the cutting process changes from a ductile mode to a brittle mode when the uncut chip thickness increases. Because the critical thickness is generally less than 1 |im, the machining rates are low in the glass cutting. The paper presents glass milling for machining of micro glass devices with improving the machining rate. The milling process with the inclined ball end mill is applied to machining of micro grooves on the glass plates. The micro grooves are machined in depths of more than 10-100 jim in a cutter feed. Some applications are shown to verify the glass milling in manufacturing of micro devices. The end milling is also combined with the FIB sputtering to control adhesion of the micro organism.
