Thermal design was performed for the power source of mobile electronic devices based on micro solid oxide fuel cells (micro-SOFC). To operate this power source in the devices, it was necessary to archive thermally self-sustaining and low surface temperature to prevent harmful damage to other electronics. One-dimensional thermal analysis revealed that high thermal insulator which prevented thermal radiative conduction and vacuum insulator could archive the requirements. The thermal insulation package based on vacuum insulator was designed and evaluated by FEM simulation. The result suggested that thermal conduction through the support was significant and the design should be modified to prevent thermal conduction and reduce the surface temperature.
