Abstract
In order to improve ductility of lead-free soldering of Sn-Cu, net shaped Sn-Cu was formed by sputtering technique newly proposed by the authors. Sn-Cu film was heated and change of the phase was measured using X-ray diffraction method. The result showed that Cu_6Sn5 which was not observed for no-heating specimen started precipitation by heating, and the amount of Cu_6Sn5 gradually increased with increasing heating temperature, and reached a constant value at a temperature about 600K. Scanning electron microscopy showed that Sn-Cu film started melting at a temperature around 65 OK. The result of bending test showed that strain at delamination of no-heated specimen exceeded 10%, and that of specimen heated at 620K and 773K exceeded 5%, which is larger than that reported for bulk Sn-Cu material.
