Abstract
Multilayer ceramic capacitors (MLCCs) are used very widely as electric devices on printed circuit boards (PCBs). Impact loads are applied on MLCCs during PCB manufacturing processes with fast mounting machines or floor dropping of mobile appliances and MLCCs may crack sometime due to the mechanical design. In this paper, impact stresses, which were induced in MLCCs under ramp loads with a split Hopkinson bar impact test equipment attached a buffer solder material, were analyzed with large scale parallel computing method.
