Abstract
Through holes were formed in printed circuit board for electric signal communication. The surface of through hole was plated by thin metal and the irregularities were shaped on the free-surface or on the interface by hole-drilling in printed circuit board. Fracture of through hole was occurred by stress concentration due to its irregularity. In this study, elastic-plastic thermal stress simulation was performed by using a large scale simulator ADVENTURECluster which was based on FEM to study fatigue strength around through hole in printed circuit board.
