抄録
Through holes were formed in printed circuit board for electric signal communication. The surface of through hole was plated by thin metal and the irregularities were shaped on the free-surface or on the interface by hole-drilling in printed circuit board. Fracture of through hole was occurred by stress concentration due to its irregularity. In this study, elastic-plastic thermal stress simulation was performed by using a large scale simulator ADVENTURECluster which was based on FEM to study fatigue strength around through hole in printed circuit board.
