抄録
For the stabilization of insulation performance in resin-molded insulators, strong adhesion between the resin and ceramic is required. In this paper, a new design technique for the control of the interfacial strength over multiple scales in resin-molded structures has been proposed. The adhesive strength of the internal interface in a resin-molded structure was estimated as the interfacial fracture energy by using the molecular dynamics method. The interfacial fracture energy was qualitatively in agreement with the adhesive strength index obtained by shear experiments. Based on the strength evaluations, the interfacial strength could be controlled, and it became clear from the results that the interfacial strength can be improved up to the confidence level. The results also show that design of the interfacial strength over multiple scales can help improve the reliability of electric power equipment.
