抄録
The stress and temperature of ultraviolet (UV) curable resin during curing were measured using a simultaneous measurement system of stress and temperature and their relationship was investigated. The specimen consisted of a mold and UV-curable rein in liquid form. The mold consisted of glass plates, acryl plates and a potassium bromide (KBr) plate. The specimen was illuminated with UV rays downwards from the upper side of the specimen. The stress and temperature were measured using a photoelastic and thermographic techniques, respectively. Results indicated the stress and temperature during curing were closely related.
