J0310103 CFD simulation of flow soldering : solder filling in narrow opening of mask

Abstract

Flow soldering process with a simple model has been studied using CFD. A printed circuit board with through-hole components and with surface-mounted components covered with a mask is the object of this study. In this process, surface mounted components are first soldered and covered with the mask; then through-hole components without the mask are soldered by dipping the board into a solder bath. We investigate the solder flow in a narrow opening between the masks. Surface tension and contact angles are decided by comparison with experiments.