J0310204 Full 3D internal strain measurement for device packaging materials using synchrotron laminography and volumetric digital image correlation method

Abstract

In order to measure full 3D internal strain field of resin molding compound specimens, synchrotron computed tomography and laminography at SPring-8 were performed. Then the reconstructed images were applied to 3D digital image correlation method to compute internal strain field. The results showed that internal strains in resin molding compound could be visualized in this way.