抄録
Aerosol deposition (AD) method is a novel deposition method. Various ceramics films can be formed on a substrate at room temperature by using AD method. Dielectric and mechanical properties of ceramics films such as PZT, BT and Al_2O_3 has been reported. However, formation of metal films by using this method has not been reported in detail. The purpose of this study is to clear the relationship between the deposition conditions and the film formation in AD method, and to investigate mechanical properties of the metal films. Nickel and Copper films were formed on a glass and stainless substrate. Cross-sectional microstructure of these films was observed by FE-SEM and TEM. Microhardness of these films was measured by Vickers hardness tester. From the results of this study, dense Ni and Cu films with thickness over 10μm were able to form on the glass and stainless steel substrate. Microhardness of Ni film increased from Hv283 to Hv532 when weight ratio of Ni powder with larger average grain size in the mixed powder was increased. Film formation and microhardness of the film depended on the condition of raw powder used for the deposition test in AD method.
