抄録
Advanced semiconductor products have structures with thickness and width in nanoscale. As the size of the structures reduces to a nanometer level, a ratio of their surface to volume increase. In the present study, the singular stress at the comer in an anisotropic two-dimensional multi-wedge joint made of three materials is analyzed using molecular dynamic method and the anisotropic elasticity theory. The joints is composed of Ni, Au and Cu. Here, the wedge angles are 4π/9 for Ni, π/2 for Au and 17π/18 for Au, respectively. The atomic stress distribution in a circumferential direction in the molecular dynamics calculation is compared with that obtained from Stroh's formalism and eigen analysis with interface properties.
