抄録
Fine ceramics has various excellent properties such as mechanical electrical properties and attracts as materials for dies and molds. However, because of many of its excellent properties such as high hardness and heat-resistant, processing methods are often become problem. One of the main processing methods of the fine ceramics is grinding, which cannot be expected as an efficient processing. In this study, the grinding process by the machining center has been executed and found more efficient grinding condition for drilling around 1mm in diameter and 3mm in depth hole for positioning pins of semiconductor dies made of newly developed zirconia ceramics. Plane grinding that assumed die sinking was also performed. As experiment results, over 3mm of the total depth of the grinding of the radial direction and over 8m of the total distance of grinding can be achieved. The results are thought as a reasonable efficiency for die sinking processing.
