年次大会
Online ISSN : 2424-2667
ISSN-L : 2424-2667
セッションID: G1300105
会議情報
G1300105 研磨パッドの研磨特性とスラリーのポンピング効果の関連性
張 宇谷 泰弘川波多 裕司桐野 宙治
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会議録・要旨集 フリー

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抄録
Various kinds of polishing pads have been utilized for polishing glasses, Si wafers, etc. In this paper, authors focus on the pumping effect of slurry in the pores of polishing pads. For improving the pumping effect of slurry, the vertical hole-structure pads were developed, which were made by epoxy resin. It was known that fluorine treatment on the inner wall of vertical holes could improve the pumping effect of slurry and raise removal rate of workpiece. Comparing to the nonwoven fabric polishing pad impregnated urethane or epoxy resin, the 2-step impregnated nonwoven fabric pad can improve the pumping effect of slurry and raise the number of polishing abrasive grains greatly. As the result, it was clarified that the polishing characteristics of pads are influenced by the pumping effect of slurry.
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