年次大会
Online ISSN : 2424-2667
ISSN-L : 2424-2667
セッションID: J0470205
会議情報
J0470205 超音波接合積層箔の組織に及ぼす接合条件の影響
劉 鴻飛高橋 智松本 和彦鈴山 淳平惣門 理
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会議録・要旨集 フリー

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抄録
Microstructures of laminated foils bonded using an ultrasonic metal bonder were investigated in order to clarify an influence of bonding conditions. Several kinds of specimens, such as laminated Cu foils bonded on a Cu tab sheet, laminated Al foils bonded on an Al tab sheet and so on, were produced with different bonding conditions. The indentation and the frequency of the horn were changed as bonding process parameters. The cross-sectional microstructures of the laminated foils parallel or perpendicular to the vibration direction of the horn were observed using SEM. It was found that microstructural features of the laminated foils were strongly dependent on the conditions of the indentation and the frequency of the horn. The increase of the indentation extended the bonding time and promoted the bonding of laminated foils. On the other hand, the well bonded areas of the laminated foils bonded at a low frequency were larger than that at a higher frequency.
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