年次大会
Online ISSN : 2424-2667
ISSN-L : 2424-2667
セッションID: J2220205
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J2220205 金属イオン濃度がNi-Wめっき膜の平坦性に与える影響に関する一考察
安井 学金子 智黒内 正仁小沢 武伊藤 寛明荒井 政大
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会議録・要旨集 フリー

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Metallic ion concentration on Ni-W planting bath had little influence on the thickness of Ni-W films. On the other hand, concentration increasing of metallic ion decreased the content rate of W in Ni-W film and suppressing nodules on Ni-W film. Ni-W plating bath with a metallic ion concentration of 0.75 M was largely similar to that of 1.0 M in content rate of W in Ni-W film and surface shape of Ni-W film. Since the content rate of W in Ni-W film and suppression of nodules are in the relationship of trade-off, it is necessary to search a metallic ion concentration that achieves high content rate of W and suppression of nodules at the same time

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