Strength Evaluation Method for Development on Power Module Structures

(Thermal Strain Measurement Using Highly Accurate Digital Image Correlation)

Abstract

Power modulues such as the electronic packaging structures are composed of various components which have different coefficient of thermal expansion (CTE). An accurate thermal strain measurement is needed to evaluate strength of the structures because thermal stress and strain occurs due to the CTE mismatch of components. In this study, a high accuracy DIC method for eliminating the periodical measurement error is applied to measuring thermal starin of electric packaging structure, and evaluated the validity and efficacy of this method. As a result, the periodical error in the measured thermal strain due to the CTE mismatch can be eliminated. Thereby measurement accuracy is improved and the precise thermal strain distributions can be observed. Therefore, this method is effective for thermal strain measurement of electronic packaging structures.