溝埋込みプロセスの溶融流動現象に及ぼす諸条件の影響

抄録

We studied a flow phenomenon of liquid into a trench with or without gas during a filling-trench process in semiconductor manufacturing. The flow was calculated using a particle method. Our goal is to find the best condition to fill trench in minimum time. Effects of parameters such as surface tension, dynamic viscosity, and initial liquid film thickness were obtained. We also calculated the flow into a micro trench.