フェムト秒レーザ還元直接描画法による 3 次元微細 Cu パターンの積層造形

抄録

Three-dimensional Cu microstructures were fabricated using dispenser coating and femtosecond laser irradiation of CuO nanoparticle solution including reductant agent. To form three-dimensional Cu microstructures, two-dimensional Cu micropatterns were repeatedly laminated layer by layer. 4 layers of Cu microstructures was fabricated and each layer of Cu micropatterns was investigated. The thickness of each layer of Cu micropatterns was approximately 20 μm. The resistance of the three-dimensional microstructures decreased with increase of the layer number, which indicates that each layer was electrically connected. On the contrary, the resistivity increased with the layer number due to decreasing the degree of reduction of Cu microstructures. To apply this process to electrical devices, we demonstrated a microbridge heater that had thermal insulate space between a substrate and a heater part. The microbridge heater generated heat at only heater part and the maximum temperature was 76.9°C at a voltage of 0.9 V. This value can be used for thermal type flow sensors.