主催: 一般社団法人 日本機械学会
会議名: 2016年度 年次大会
開催日: 2016/09/11 - 2016/09/14
In this study, we aim to improve the productivity of the next generation semiconductor substrates (such as SiC, GaN, Diamond etc.) through reduction of process time and production cost. Thus, our purpose is to contribute to the wide-spread usage of green devices. Here, we have developed the world's first special viscoelastic dilatancy material polishing pad which is sensitive to process conditions. We also developed a high-speed / high-pressure processing machine which can achieve high efficiency polishing of hard-to-process materials. Combination use of the developed polishing pad (Dilatancy pad® : Fujibo Ehime Co., Ltd.) and the developed processing machine (SLM-140H : Fujikoshi Machinery Corp.) has made it possible to reduce the total processing time to below one fifth of conventional processing time, which is typically required in the conventional device production. This polishing process could achieve high-efficiency and high-quality simultaneously, which are trade-off relationship in the conventional process. Considering a significant reduction of the production cost is anticipated (operating cost of the processing machine, slurry consumption, etc.), we hope that this polishing process would be contributed to the productivity improvement of the next generation semiconductor devices.
